Product Features:
1. The curing temperature of this product shall not be lower than 110°C.
2. This product is stable during storage.
3. This product is a paste and does not drip.
4. Exhibits excellent bond strength after curing.
Product Applications: This product is suitable for bonding electronic components such as metal coils, electronic coils, and inductors.
YD-E500 One-Component Epoxy Structural Adhesive (Low-Halogen)
Category:
Keywords : Other
Testing Equipment
Through continuous technological development, automation of production equipment, and research and development of multiple patented products, it is basically possible to replace similar products in European and American countries, breaking the monopoly of foreign products in China.
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